AYUNCHE Enrich Bonding Mini Kit
Intensive Damage Care Shampoo & Mask Mini Kit
The synergetic nourishing effect from a bonding technology, using a patented ingredient* for hair damage repair, and Vita Complex* provides rich nutrients and vitality to distressed hair.
Full-softness
The soft and cloudy foam produced from the highly adherent and rich formula densely sits on the hair to presents a highly pleasant experience.
Rich Nutrition Formula
The nice, thick formula created using the patent-applied* lipid mimic composite
*Patent applied ingredient: Lipid mimic composite composition [Paten application no. 10-2018-0035249]
Product Information
Product Information
Shipping & Returns
Shipping & Returns
AYUNCHE Enrich Bonding Mini Kit
AYUNCHE Enrich Bonding Mini Kit
Intensive Damage Care Shampoo & Mask Mini Kit
The synergetic nourishing effect from a bonding technology, using a patented ingredient* for hair damage repair, and Vita Complex* provides rich nutrients and vitality to distressed hair.
Full-softness
The soft and cloudy foam produced from the highly adherent and rich formula densely sits on the hair to presents a highly pleasant experience.
Rich Nutrition Formula
The nice, thick formula created using the patent-applied* lipid mimic composite
*Patent applied ingredient: Lipid mimic composite composition [Paten application no. 10-2018-0035249]
Original: $14.18
-65%$14.18
$4.96Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Intensive Damage Care Shampoo & Mask Mini Kit
The synergetic nourishing effect from a bonding technology, using a patented ingredient* for hair damage repair, and Vita Complex* provides rich nutrients and vitality to distressed hair.
Full-softness
The soft and cloudy foam produced from the highly adherent and rich formula densely sits on the hair to presents a highly pleasant experience.
Rich Nutrition Formula
The nice, thick formula created using the patent-applied* lipid mimic composite
*Patent applied ingredient: Lipid mimic composite composition [Paten application no. 10-2018-0035249]
